| 摘要 |
PURPOSE:To easily secure a semiconductor element flat on a die pad of a lead frame and to manage quantitatively the thickness adhesive between the lead frame and the die pad of the semiconductor element. CONSTITUTION:An adhesive 12 mixed with a plurality of globular gap materials 14 of the same diameter is applied to a die pad section 13 of a lead frame. Then, a semiconductor element 11 to be bonded is placed on the adhesive 12 applied to the die pad section 13. After that, pressure is applied to the adhesive 12 from on the semiconductor element 11 to expand the adhesive 12 to the uniform thickness. Finally, the adhesive is heat-cured to secure the semiconductor element 11. At that time, the thickness of the adhesive 12 between the semiconductor element 11 and the die pad section 13 of the lead frame is determined by the diameter of the gap materials 14.
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