| 摘要 |
<p>PURPOSE:To reduce the number of layers properly required for a main circuit board by a method wherein a directly connecting wiring pattern connecting the interval between plural relay terminals only intersecting with the other wiring patterns in no contact with one another is arranged for mounting this board on a main circuit board. CONSTITUTION:Semiconductor chips 101a-101c are mounted on the main surface of a MCM board 10 furthermore, chip pads 102, peripheral pads 103 and wiring patterns 4 are arranged. On the other hand, the MCM board 10 is a multilayer- structure board while the wirings are arranged extending over multiple layers. Furthermore, a directly connecting wiring pattern 4a connecting to the interval between two peripheral pads 103 only is arranged. This directly connecting wiring pattern 4a is a kind of jumper wiring intersecting with the other wiring patterns 4 in no contact therewith. That is, the directly connecting wiring pattern 4a can be intersected with the other wiring patterns 4 in no contact with one another by arranging in mutually different layers at the positions C, D.</p> |
