TRIMMING METHOD FOR CHARACTERISTIC OF SEMICONDUCTOR DEVICE,申请号JP19930232123-传众专利搜索

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发明名称	TRIMMING METHOD FOR CHARACTERISTIC OF SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH0786521(A)	申请公布日期	1995.03.31
申请号	JP19930232123	申请日期	1993.09.20
申请人	FUJITSU LTD	发明人	OZAKI SUSUMU
分类号	H01L21/66;H01L21/822;H01L27/04;(IPC1-7):H01L27/04	主分类号	H01L21/66
代理机构		代理人
主权项
地址

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