| 摘要 |
PURPOSE:To obtain the title module which is low-cost, whose density is high, whose speed is high and whose design and manufacture are flexible. CONSTITUTION:The title module is constituted so as to be provided with a base board 30, with a thin-film multilayer circuit board 32 which is formed on the first face of the base board and in which insulating layers and wiring conductors are laminated alternately, with circuit elements 14, 16 which are formed on the main face of the thin-film multilayer circuit board and with terminals 34 which are supported on the main face of the thin-film multulayer circuit board and by which wiring conductors are connected to an external circuit formed on a wiring board. |
