Method for smoothing the edge of semiconductor wafers
摘要
The invention relates to a method for smoothing the edge of semiconductor wafers, if appropriate also in the notch of a semiconductor wafer, a compressible, diamond-impregnated fabric being pressed as working surface of a polishing tool with a determined force against the edge of a semiconductor wafer, and the semiconductor wafer and/or the working surface executing a rotational movement.
申请公布号
DE4325518(A1)
申请公布日期
1995.02.02
申请号
DE19934325518
申请日期
1993.07.29
申请人
WACKER-CHEMITRONIC GESELLSCHAFT FUER ELEKTRONIK-GRUNDSTOFFE MBH, 84489 BURGHAUSEN, DE