| 摘要 |
<p>Process for producing at least one low-resistance electrical connection between a metal and a component made of superconductive HTC ceramic, the said component being manufactured from a ceramic powder which is introduced into a mould, which is compressed and which is sintered, characterised in that, in the said mould, at least one volume of silver or gold powder corresponding to the shape of the said connection and situated in the intended place is placed alongside the said ceramic powder without mixing with it, and that after the compression the sintering operation takes place under an atmosphere containing oxygen at a temperature below the melting point of silver or gold.</p> |
