| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer stereoscopic circuit board and the manufacturing method thereof which is compact in spite of the structure including many layers, in comparison with the case laminating a plurality of stereoscopic circuit boards, owing to forming multilayer circuit patterns via insulating layers on a single stereoscopic circuit board. SOLUTION: The multilayer stereoscopic circuit board comprises a stereoscopic circuit board 1 of one of molded goods; multilayer circuit patterns 21, 22,..., laminated via film forming type insulation layers 4 on one or more surfaces of the stereoscopic circuit board 1; and connecting circuit patterns 30, 31 formed on the build-up surfaces built up from the one or more surfaces of the stereoscopic board wherein at least one end of each of them is connected with either one of the plurality of circuits patterns 21, 22,..., laminated via the insulation layers 4 in the multilayer circuit patterns. In this way, on the single stereoscopic circuit board 1, the multilayer circuit patterns 21, 22,..., are formed via the insulation layers 4, and the connections among these circuit patterns 21, 22,..., etc., are performed by the connecting circuit patterns 30, 31 provided on the build-up surfaces provided in the stereoscopic circuit board 1. |
