A curable resorcinol-based epoxy resin is disclosed having the general structural formula (I) (* CHEMICAL STRUCTURE *) (I) wherein at least one of R1, R2, or R3 is selected from the group consisting of (a) the general structural formula (II) (* CHEMICAL STRUCTURE *) (II) wherein R4 is selected from the group consisting of hydrogen and an alkyl group having 1 to about 4 carbon atoms, and (b) an allyl group.
申请公布号
WO9415986(A3)
申请公布日期
1994.09.29
申请号
WO1994US00556
申请日期
1994.01.18
申请人
INDSPEC CHEMICAL CORPORATION;DURAIRAJ, RAJ, B.;TACKIE, MICHAEL, N.