发明名称 |
Method for forming a flip-chip bond from a gold-tin eutectic |
摘要 |
A method for flip-chip bonding an integrated circuit die to a substrate. A substrate (21) having conductive bonding areas (22) coated with tin (23) is secured to a bottom end effector of a flip-chip bonding apparatus. An integrated circuit die (26) having gold bumps (28) is secured to a die tool of the flip-chip bonding apparatus. A gold-tin eutectic bond is formed between the integrated circuit die (26) and the conductive bonding areas (22) of the substrate (21).
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申请公布号 |
US5346857(A) |
申请公布日期 |
1994.09.13 |
申请号 |
US19920952005 |
申请日期 |
1992.09.28 |
申请人 |
MOTOROLA, INC. |
发明人 |
SCHARR, THOMAS A.;LEE, RUSSELL T.;SUBRAHMANYAN, RAVICHANDRAN |
分类号 |
H01L21/60;(IPC1-7):H01L21/283;H01L21/58;H01L21/603 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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