| 摘要 |
PURPOSE:To obtain a lead frame and a semiconductor device having high reliability by adhering an insulation tape having a heat curable adhesive material on an upper or lower surface of an inner lead, and providing a thermoplastic adhesive material on an opposite surface of the tape. CONSTITUTION:A heat curable adhesive material 9 such as polyimide resin, epoxy resin, etc., is provided on one surface of an insulation tape 8, a thermoplastic adhesive material 10 such as synthetic resin, etc., is provided on the other surface, adhesive temperatures of both are differentiated, and the surface provided with the material 9 is adhered to an inner lead 1. The lead 1 is brought into contact with a low temperature heating block 16, a chip 14 is placed at the material 10 of the tape 8, thermally plasticized by a heating block 17 to be heated to an adhering temperature such as 300 deg.C, and adhered. Accordingly, since adherence with the lead is heat curable, it becomes further rigid by heating the adhesive of the chip, peeling, a positional deviation do not occur, and reliability can be improved.
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