| 摘要 |
A silicon-modified, adhesive polyimide film composed mainly of the repetition units of the formula (I) and a process for producing a polyimide film composite product using the above film are provided, the formula (I) being (* CHEMICAL STRUCTURE *) (I) wherein L1 is -O- or -CO-R3 represents (* CHEMICAL STRUCTURE *) (II) (* CHEMICAL STRUCTURE *) (III) -(CH2)s-+BL,4 or(IV) (* CHEMICAL STRUCTURE *) (V) (S: 1-4), (SILO) is TR,29 (* CHEMICAL STRUCTURE *) (VI) (R5: 1-6C alkyl, phenyl or alkyl-substituted phenylof 7-12C; m: 1<m<=3),(PI) is (* CHEMICAL STRUCTURE *) or (* CHEMICAL STRUCTURE *) (VII) (L 2 is -O- or -CH3; R1 may be same as R5;R2 may be same as R3;l: 1<=l<=100; n: 1<=n<=3), and p and q satisfy (* CHEMICAL STRUCTURE *) (VIII) (* CHEMICAL STRUCTURE *) (IX) the above process for producing a polyimide film composite product comprising subjecting the above-silicon-modified polyimide film to contact-bonding on heating to a material to be adhered, at an ultimate curing temperature of 130 degrees-230 degrees C. The above polyimide film is highly adhesive and heat-resistant in spite of heating at a relatively low temperature.
|
