| 摘要 |
<p>PURPOSE:To provide the manufacturing method of a high-reliability semiconductor device wherein dust particles do not adhere to, and a flaw is not caused in, a semiconductor element. CONSTITUTION:First, a UV-curing resin 3 is applied to the surface of a wafer before it is cut; the rear of the wafer 1 is bonded to, and held by, an adhesive sheet 4. Then, the wafer is cut from the upper part of the UV-curing resin 3; chip-shaped semiconductor elements are formed on the adhesive sheet. Then, the adhesive sheet is stretched; the semiconductor elements are separated from each other; individual intervals are widened; the semiconductor elements 11 are taken out from the adhesive sheet and placed on a base. After that, the semiconductor elements are irradiated with ultraviolet rays; the UV-curing resin 3 is hardened and stripped.</p> |
