| 摘要 |
<p>A method for mounting a LSI chip (1) with conductive bumps (2, 3, 4) as terminals into a hole (15) of a card (5) and for interconnecting them. The card and therefore one end of the hole is first covered by a layer (16) of a conductive material. Then the conductive bumps of the chip placed in the hole are soldered to the layer whilst being pressed against this layer. Thus protrusions (17, 18, 19) are created on the external surface of the layer. These protrusions are used to facilitate the alignment of the mask used during the subsequent etching operation of the layer. The invention also concerns a process for creating the conductive bumps (2, 3, 4) on the terminal pads (6, 7, 8) of the LSI chip (1).</p> |
