| 摘要 |
PURPOSE:To enable an insulating vanish to creep in the part between fine metallic wiring patterns in order to coat the title high density multilayer wiring substrate with the insulating vanish. CONSTITUTION:A substrate 1 whereon wiring patterns 2 are formed is spin- coated with an insulating vanish 4 in low viscosity to be vacuum-dried up. Furthermore, the insulating vanish 4 is spin-coated with another insulating vanish 5 in high viscosity to be dried up again. Through these procedures, the swell and cracking of insulation due to defective wetting can be avoided thereby enabling a thick filmed insulating layer having excellent wettability to be formed. |
