| 摘要 |
PURPOSE:To provide a method for manufacturing a heat dissipating plate for a thyristor which can be inexpensively efficiently manufactured and has a high thermal conductivity without large loss of strength in comparison with a heat dissipating plate manufactured by a conventional hot pressing method. CONSTITUTION:A heat dissipating plate 7 for a thyristor is formed by the steps of pressure-molding a mixture of aluminum nitride powder and sintering assistant to form a molded from, baking the form by a normal pressure sintering method or by an atmosphere pressurizing sintering method to form a sintered material having a thermal conductivity of 100-250W/m.k, and forming it in a predetermined shape out of the material. |
