INTEGRATED CIRCUIT PACKAGE

摘要

PURPOSE:To make it possible to mount a micro circuit package without degrading its transmission characteristic by bonding an insulation board on which a conductor pattern is formed with a metal header and forming a micro stripline on the insulation board. CONSTITUTION:A through hole 4 is installed to an alumina board 1 which serves as an insulation board. A conductor pattern 3, which forms a micro stripline in a subsequent process is laid out in such a fashion that it may face the through hole 4. It is soldered with a metal header 2 and a metal pin 5. A package 11 is inserted from the ground side of a circuit board 10 so that the micro stripline of the circuit board 10 may be soldered with the micro stripline of the package 11 formed in such a fashion that the impedance may be matched preliminarily. This construction makes it possible to mount the package without degrading its transmission characteristic.