| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor sealing composition which is excellent in curability and has a low volume shrinkage ratio and weight loss ratio when cured and from which a cured product having excellent transparency and strength is produced. <P>SOLUTION: The optical semiconductor sealing composition contains (A) a siloxane compound having a weight average molecular weight (Mw) expressed in terms of polystyrene, measured by gel permeation chromatography, of 100-1,000,000 and an epoxy equivalent of 50-500,000 g/eq, and (B) a siloxane compound having a weight average molecular weight (Mw) expressed in terms of polystyrene, measured by gel permeation chromatography, of 100-1,000,000 and at least one acid anhydride structure in the molecule. <P>COPYRIGHT: (C)2011,JPO&INPIT |
