| 摘要 |
PURPOSE:To solve problems such as shape abnormality due to deterioration of plating solution, short-circuit between patterns due to cracks of a plating mask, re-attachment of etching material in the case of etching a current path at the time of electroplating, and side etching, when wiring is formed by a plating process. CONSTITUTION:Firstly aluminum 4 is etched by using a photo resist pattern 5. Successively a pattern of plating gold 6 is formed by using the patterned aluminum 4 as a mask for plating.
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