| 摘要 |
PURPOSE:To obtain recesses and protrusions uniformly on the bump section of a semiconductor element for a face-down mounting. CONSTITUTION:A mold 12, to be used for a bump formation, is manufactured by forming recesses and protrusions in uniform depth on a plate material 10a to be used for a mold, and on the other hand, after formation of flat bumps 14 on the electrode part of a semiconductor element 1, the bump part 14 of the semiconductor element 13 is stamped on the recess and protrusion part 11 of the mold 12 to be used for a bump, and grooves 15, having recesses and protrusions in uniform depth, is formed. |
