发明名称 TAB AND FABRICATION THEREOF
摘要 PURPOSE:To provide a TAB and a method of fabrication thereof in which copper is employed as a conductor pattern and which has no broken wire or crack at a folded portion and is excellent in the bend property. CONSTITUTION:There is provided a TAB and a method of fabrication thereof, in which copper is employed as a conductor pattern and a base film at an folded portion is slit, and wherein a resin coating layer 4 is provided on the external surface of a bent portion of the conductor pattern 1 and/or on the internal surface of the same.
申请公布号 JPH053228(A) 申请公布日期 1993.01.08
申请号 JP19910178882 申请日期 1991.06.25
申请人 MITSUI MINING & SMELTING CO LTD 发明人 KATAOKA TATSUO;MAKITA HIDEAKI
分类号 H01L21/60;H05K1/00 主分类号 H01L21/60
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