Solvent resistant silicone polyimides.

摘要

Silicone polyimides resulting from the condensation of para phenylene diamine and an organic dianhydride mixture of a bis(phthalic anhydride)poly(diorganosiloxane), a 2,2 bis[4-(3,4-dicarboxyphenoxy)phenyl] propane dianhydride and hydroquinone dianhydride in a dipolar aprotic solvent have been found to be substantially insoluble in chlorinated organic solvents such as chloroform and useful as melt extrudable wire coating compositions.