摘要 |
PURPOSE:To obtain the resin composite excellent in plating resistance by blending a determined amount of a cross-linking monomer and a determined amount of a photopolymerization initiator to a binder thermoplastic polymer. CONSTITUTION:A composite is obtained by copolymerizing 15-23wt.% of a first polymerizing material having 3-15 carbon atoms and consisting of one or more compounds of alpha,beta-unsaturated carboxyl group containing monomers, 2-25wt.% of a second polymerizing material consisting of one or more compounds selected from the group consisting of compounds represented by the formula I and ring substituted derivatives thereof, 10-40wt.% of a third polymerizing material and 30-70wt.% of a fourth polymerizing material as shown in the note, and blending, as main components, 45-75 parts by weight of a binder thermoplastic polymer in which [eta] measured at 25 deg.C using a dimethylformamide solution of 0.1 mole/l of sodium thioacyanate ranges from 0.30 to 0.40, 20-50 parts by weight of a cross-linking monomer having two or more ethylenic unsaturated groups in one molecule, and 0-10 parts by weight of a photopolymerization initiator so as to be 100 parts by weight in total. |