| 摘要 |
A lead frame comprising a lead frame base of a Cu alloy and an oxide layer formed thereon. The Cu alloy is the one which has dispersed particles, part of which distribute and is exposed on the surface of the alloy, or the one containing P of 30 ppm or less. In the case of the lead frame base made of the alloy containing the dispersed particles, since an oxide layer including oxides of the dispersed particles is formed, the adhesiveness of the oxide layer is improved. In the case of the lead frame base made of the Cu alloy including a specified amount of P, an oxide layer having an excellent adhesiveness can be formed too. By virtue of such oxide layers, the adhesiveness to a shielding resin is improved and the reliability of a semiconductor package can be improved. <IMAGE> |
