VERBINDUNG ZWISCHEN EINEM CHIP UND EINER SCHALTUNGSPLATTE.

摘要

A configuration is disclosed for attaching leads (15) from several chips (1a-1d) to bus (5a) lines (9a-9m) on a printed circuit board (6). The bus (5a) includes pads (13), each directed toward one of pads (3) on the chip to be connected by arched wires (15). Lines (9a-9l) connected to each end of the board pads (13) and extend generally parallel to the chips (1a-1d) past the sections containing the pads (3). Lines (9a-9l) are displaced alternately toward and away from the chips (1a-1d) at sections containing pads (13) directed toward the chips (1a-1d) or having a part (17) taking a corresponding direction. The pads (13) alternate on opposite sides of each chip (1) to minimize the length of the leads (15) and to allow a central chip pad (3V) for carrying operating voltage (or ground) to connect to the outermost line (9m). This reduces the board space used for a bus (5a) and minimizes the length of wires (15) connecting chips (1a-1d) to a bus (5a).