| 摘要 |
<p>PURPOSE:To reduce manufacturing manhours irrespective of the shape of a module when manufacturing it by attaching a semi-conductor module to an opening for the module with an electrode terminal exposed to the surface of a card base, which is loaded in a mold die, and molding resin. CONSTITUTION:A frame 12 is loaded in a bottom force 16 of a die, and a module 2 is allowed to fit into a frame 14 for a module of the frame 12 in such a manner that the module 2 comes in contact with the surface of the die. Next, the top force 16 of the die is placed over the lower force 16 and a molding die 15 is tightly closed. After that, a thermally molten molding resin 13 is poured into a cavity 18 from a gate 19. After completely curing the resin 13, the frame 12 is removed from the molding die 15 to complete an identification card. The IC has an almost flat surface. An opposite part to an electrode terminal 7 of the module 2 can be molded in whatever shape and thickness, provided that a clearance through which the molding resin 13 flows in is present.</p> |
