发明名称 RESIN COMPOSITION FOR USE IN ELECTRONIC PARTS SEALING
摘要 PURPOSE:To provide the titled composition of little corrosive action, moldable at low temperatures and low pressures, comprising an epoxy acrylate containing little Cl<-> and Na<+>, peroxide catalyst, filler, releaser and silane coupling agent in specified proportion. CONSTITUTION:The objective composition comprising (A) 100pts.wt. of an epoxy acrylate containing <=5ppm of Cl<-> and <=5ppm of Na<+> (e.g. bisphenol A glycidyl ether type epoxy acrylate), (B) 0.1-10pts.wt. of a peroxide catalyst (e.g. methylethyl ketone peroxide) and/or azobic catalyst (e.g. 1,1-azobis cyclohexane-1-carbonitrile), (C) 10-600pts.wt. of filler (e.g. alumina), (D) 0.1-5 pts.wt. of a releaser (e.g. carnauba wax) and (E) 0.1-5pts.wt. of a silane coupling agent (e.g. vinyltrichlorosilane).
申请公布号 JPS62143917(A) 申请公布日期 1987.06.27
申请号 JP19850284696 申请日期 1985.12.17
申请人 NIPPON RETSUKU KK 发明人 YAMANE SHOICHI;NAKAHIRA KAZUHIRO;OKUNO ATSUSHI;HASHIMOTO TSUNEICHI
分类号 H01L23/29;C08F290/00;C08F299/02;H01L23/31 主分类号 H01L23/29
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