| 摘要 |
<p>PURPOSE:To prevent chips from dispersing by forming grooves through cutting in a first direction a work fixed on a support material with a bonding agent, and by making a filler having a bonding or adhering force flow into the formed grooves, and by cutting thereafter the work in a second direction and then removing the bonding agent and the filler. CONSTITUTION:A work 3 fixed on a support base board 1 with wax 2 is cut in a first direction fully to the extent of eating into a part of the surface of the support base board 1, using the blade of a dicing machine rotated at a high speed. When the cuts of necessary times in the first direction are completed, a filler 5 is made to flow into a plurality of grooves 4 formed by cutting. Then, after turning the direction of the work 3 by 90 degrees, it is cut fully in a second direction orthogonal to the first direction. Thus, by dipping the work 3 in a solvent together with the support base board 1, the wax 2 and the filler 5 are dissolved, and the work 3 is divided into individual chips. Since in this manner, the work 3 is cut in the second direction after filling the grooves 4 with the filler 5, such positional discrepancies due to deformation of the work 3 as the widths of the grooves 4 change, are prevented. Thereby, the stresses applied to the chips are reduced, and the chips can be prevented from dispersing.</p> |
