发明名称 |
Device for testing semiconductor integrated circuits and method of testing the same |
摘要 |
Tests of a semiconductor IC is conducted first by bringing a plurality of conductive pattern circuits formed on an insulator sheet into contact with a plurality of bump electrodes formed on a substrate of the semiconductor, second by connecting a plurality of signal transmission pattern circuits formed on a transmission circuit substrate with each conductive pattern circuit of the insulator sheet, and then by connecting the transmission circuit substrate with a body of the testing device. A probing test can be simplified since there is no need to manually adjust positions of conventional probe needles. Further, semiconductor ICs having a lot of bump electrodes can be test without being damaged.
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申请公布号 |
US5089772(A) |
申请公布日期 |
1992.02.18 |
申请号 |
US19900491089 |
申请日期 |
1990.03.09 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD.;MARTEC CORPORATION |
发明人 |
HATADA, KENZO;ISHIHARA, TAKESHI;SUZUKI, NOBUAKI;KURODA, SATOWAKA |
分类号 |
G01R31/26;G01R1/073;H01L21/66 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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