| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor module which firmly fixes a resin case and a top plate. SOLUTION: The module is provided with a metal base 2, a power semiconductor element 6 which is soldered on the metal base 2 with an insulation board 4 interposed, a resin case 10 connected to an end part of the metallic base 2, sealer 14 which seals a power semiconductor element inside a resin case, and a top plate 12 which is fit to an upper end part of a resin case. It is further provided with a groove 11a formed in an area near an upper end of opposite frames of the resin case 10 and a projection 12a, which is provided to both end parts of the top plate 12 and fit to the groove 11a.</p> |
