| 摘要 |
<p>PURPOSE:To give sufficient suction force to a substrate holding means by installing a first suction chuck and a second suction chuck having a suction surface on the same plane as the first suction chuck and being movable in the normal direction of the surface of a substrate at the position of delivery to the substrate holding means and delivering the substrate between the second suction chuck and a carrying band. CONSTITUTION:When a wafer 11 is delivered from a substrate holding means to a carrying hand 12, vacuum suction by a first suction chuck 17 is released in the first suction chuck 17 and a second suction chuck 20 sucking the rear of the wafer 11 under a vacuum, and a Z driving shaft 19 is forward moved up to the position of noninterference by an actuator. The carrying hand 12 is advanced up to the location of delivery, and the rear of the wafer 11 is abutted against the suction surface of the carrying hand 12. Even when the surface of the wafer 11 is inclined to the suction surface of the carrying hand 12 at that time, the inclination is sucked by four leaf springs 221-224 supporting the second suction chuck 20, thus pushing the rear of the wafer 11 against the whole suction surface of the carrying hand 12.</p> |
