| 摘要 |
<p>PURPOSE:To enable an outer lead terminal to be firmly, directly fitted to a circuit wiring film by a method wherein a brazing material interposed between the wiring film and the outer lead is selectively heated to fuse by the irradiation with heat rays such as a laser beam or the like to fit them together. CONSTITUTION:An insulating film 5 formed of organic high molecular material such as polyimide resin or the like and a circuit wiring film 6 formed of metal such as aluminum, copper, chrome, nickel, or the like are formed on the upside of a ceramic board 1 through a thin film forming technique. The electrode of a semiconductor device 4 is electrically connected to a part of the circuit wiring film 6 through the intermediary of a bonding wire 7, and an outer lead terminal 8 connected to an outer circuit board is directly connected to the other part of the circuit wiring film 6 through the intermediary of a brazing material 9 such as silver solder or the like. The outer lead terminal 8 functions so as to connect the internally housed semiconductor device 4 to an external circuit, where the internally housed semiconductor device 4 is electrically connected to the external circuit through the intermediary of the circuit wiring film 6 and the outer lead terminal 8 by connecting the outer lead terminal 8 to the outer circuit board.</p> |
