| 摘要 |
A process for preparing a thermosetting resin composition by curing at a temperature of < 160 DEG C a composition comprising: a) a ketoxime-blocked isophorone diisocyanate, and b) an aqueous solution of a water-soluble resin binder which is essentially free from epoxy groups and which has the general formula A-B-(-C-B)m-A, in which m is 1 to 6, A is a tertiary amino group, B is a divalent group of formula -D-O-R-O-(-D-O-R-O-)n-D-, in which n is 0 to 10, D is a group of formula -CH2-CH(OH)-CH2-and R is the hydrocarbon residue of an aliphatic or aromatic dihydroxy compound, and C are the same or different divalent organic groups comprising one or two bridging secondary or tertiary amino group(s) linked to B, at least one of the said amino groups attached to C having the formula <CHEM> in which R' is C4 to C16 alkyl and D is as set out herein. n
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