| 摘要 |
PURPOSE:To make it possible to obtain a laminated lead frame having superior quality and a high reliability for semiconductor device use by a method wherein the lead frame is constituted in such a way that the heights of the upper surfaces of first and second inner lead parts become almost the same height. CONSTITUTION:A first substrate 22 is folded back upward by the amount of a wire bonding dimension A desiged in a dimension capable of bonding sufficiently a wire 27 and is processed. Moreover, the heights of the respective upper surfaces of inner lead parts 23 of the substrate 22 and inner lead parts 25 of a second substrate 24 are formed in almost the same height and the substrate 24 is laminated on the substrate 22. |
