A system and method for manufacture of micro-panels.

摘要

A multilayer board (10) is comprised of upper (14) and lower (16) conductive layers with an insulative layer (12) sandwiched therebetween. Geometric patterns are defined in the upper layer alternately by slots (32) extending therethrough and material sections (36) between the ends of adjacent slots. Identical geometric patterns are defined in the lower conductive layer in vertical registry with the upper patterns with slots and material sections in the lower layer corresponding to material sections and slots of identical length and orientation vertically thereabove respectively in the upper section. All material sections in either the upper or lower layer thereby have a correlative slot therebelow or thereabove in vertical registry in the lower or upper layer, respectively. With respect to a given preselected pattern, by punching through the slots in the upper and lower layers partially defining the pattern and continuing therethrough to penetrate through the opposing correlative vertically aligned material section of the lower or upper layer, a micro-panel is thereby formed in the shape of the pattern upon severance from the board. Due to slot-material section configuration so that no conductive material is directly in vertical alignment with a slot, upon severance conductive material of one layer is prevented from smearing and thereby shorting out to the other conductive layer.