发明名称 Arrangement for removable connection between substrates
摘要 An arrangement for removable connection between substrates including a first and a second substrate and a first connector mounted on the first substrate and a second connector mounted on an edge portion of the second substrate. The second connector is adapted to be engaged with the first connector. The arrangement also includes a third connector mounted on the first substrate with the third connector having first and second contacts. A third contact is provided in the vicinity of the edge portion of the second substrate and is adapted to contact the first contact of the third connector during an initial stage of an engaging process of the first and the second connectors and to contact the second contact of the third connector after the initial stage.
申请公布号 US4934941(A) 申请公布日期 1990.06.19
申请号 US19890293423 申请日期 1989.01.04
申请人 NEC CORPORATION 发明人 OKADA, YOSHIKATSU
分类号 H01R13/53;H01R12/04;H01R12/16;H05K7/14 主分类号 H01R13/53
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