POWDER FOR USE IN DRY SENSITIZATION FOR ELECTROLESS METAL DEPOSITION

摘要

The invention relates to a powder for use in dry sensitization for electroless metallization. The power comprises finely powdered particles of a plastic material and 0.1 to 10 weight% of a sensitizing compound and 0.01 to 10 weight% of a surfactant. Upon melting down of the powder on a substrate a well-defined metallization edge results after subsequent electroless metallization.