| 摘要 |
PURPOSE:To have a preciser and faster handling of the semiconductor device, by making some notches around the outer frame of the lead frame and some protrusions that match the notches in the box type container. CONSTITUTION:Finished semiconductor device 6 is connected to the lead frame 8 by the tab lead 7, and also to the outer frame 11 by the dam 10. The notches 12 are made around the outer frame 11, one on each side. The main body 18 of the container 17 can freely be taken out of the container by opening the cover 14, 15 on both the upper and lower side of the container. The inner dimension of the container is a little larger than that of the outer frame 11, and the longitudinal protrusions 16 that match the notches 12 are formed inside the container. This formation facilitates a preciser and faster handling and the semiconductor is supported without sway in the container. |
