| 摘要 |
<p>PURPOSE:To execute positioning and the fixation of a lead extremely simply by forming a projection to one side surface of the lead and fitting the projection into the hole, etc. of a substrate. CONSTITUTION:The small piece-shaped leads 12 for external draw-out are projected toward the side from the side surface of a package proper 11 in the semiconductor device 10. A plurality of these leads 12 are bent slightly on their midways, but the levels of the lower surfaces of the nose sections of the leads are made the same as the bottom of the package proper 11 in each nose section. The downward projections 13 are formed by bending one parts of the nose sections downward in a projecting shape in each lead 12. When the holes 15 are each formed previously at the lead fixing positions of the substrate 14 for mounting, the semiconductor device can be positioned to the substrate 14 extremely easily because the projections 13 are each fitted into these holes 15.</p> |
