| 摘要 |
PURPOSE:To make a plurality of semiconductor elements contact uniformly with a uniformly-heating plate and thereby to enable the execution of a precise temperature test, by inserting the semiconductor elements into the through holes of the uniformly- heating plate with pressure through spacers provided between the semiconductor elements and sockets. CONSTITUTION:Optical semiconductor elements 41-43 fitted in sockets 31-33 fixed to a base plate 2 are inserted removably into the ends on one side of a plurality of through holes 11-13 provided in a uniformly-heating plate 1 made of metal and having heaters H, respectively, while photosensing elements D1-D3 are inserted into the other ends thereof. The uniformly-heating plate is retained by a retaining frame 5, while the base plate 2 is retained by a retaining frame 62 having a front plate 61. Between the elements 41-43 and the sockets 31-33, cap-shaped spacers 71-73 are provided, and an elastic member 8 of a silicon rubber sheet or the like and a guide plate 9 for preventing omission are provided for the spacers 71-73. When the retaining frame 62 is pressed on the uniformly-heating plate 1 to insert the elements 41-43 into the through holes 11-13, a dimensional error in the pressing direction due to differences in the depth of the through holes 11-13, or the like, is absorbed by the compression elastic flexure of the member 8, and therefore all of the elements are fixed in the uniformly-heating plate 1 without fail. |
