发明名称 POLYACETAL RESIN COMPOSITION HAVING IMPROVED THERMAL STABILITY AND FREED FROM PROBLEM OF MOLD DEPOSIT
摘要 PURPOSE:To provide the titled compsn. which does not suffer discoloration nor deterioration during molding and is freed from deposition of fine powdered materials on the inner surface of a mold, by incorporating melem in a polyacetal resin. CONSTITUTION:Melem (which is obtd. by firing area, has the structure of the formula, does not have any definite melting point, is hardly decomposed by heat, and is a weakly basic compd.) is used as a heat stabilizer. 0.001-2pts.wt. melem is blended with 100pts.wt. polyacetal resin. Pref. 0.01-10pts.wt. polyamide resin is used together.
申请公布号 JPS5933353(A) 申请公布日期 1984.02.23
申请号 JP19820141844 申请日期 1982.08.16
申请人 ASAHI KASEI KOGYO KK 发明人 KURIHARA MASAKAZU;KATOU TAKEO
分类号 C08K5/34;C08L59/00;C08L77/00 主分类号 C08K5/34
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