发明名称 METHOD FOR REMOVING PERIPHERAL PATTERN OF SUBSTRATE
摘要 PURPOSE:To improve production speed by connecting a copy model and a substrate in a fixed positional relationship with each other while controlling the position of a grinding wheel by a copy member contacting the outer periphery of the copy model and moving relatively therewith. CONSTITUTION:A substrate 11 received in a panel cassette 17 is transferred onto a loader 25 by a vacuum chuck on an end of a robot 24 to be located by guides 27, 28. Then, the loader 25 is located in a working position and the substrate 11 is lifted by a substrate holder 33 and pressed against a pinching section 31a of the lower portion of a copy model 31 to be piched and supported. Then the model 31 and substrate 11 are connected in a fixed positional relationship with each other. Then, a support arm 36 is advanced and a rotating grinding wheel 37 is adapted to contact on the outer periphery the outer periphery of substrate 11 to start grinding while the outer peripheral surface of a copy member 35 is adapted to contact that of model 31. And the model 31 and the substrate 11 integral therewith are rotated to move the copy model 35 relatively along the outer peripheral surface of model 31 and control the position of grinding wheel 37 for grinding the substrate 11.
申请公布号 JPS63256350(A) 申请公布日期 1988.10.24
申请号 JP19870091744 申请日期 1987.04.14
申请人 TOSHIBA CORP 发明人 KOMATSUBARA YUKIO
分类号 B24B9/00;B24B9/06;G09F9/30;H01L21/304 主分类号 B24B9/00
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