| 摘要 |
PURPOSE:To detect a defect of a wiring pattern speedily and automatically by storing data on the wiring pattern on the surface of a normal article in a storage means as reference data, and comparing this wiring pattern with the wiring pattern on a wafer surface to be inspected by a CPU. CONSTITUTION:The wafer 7 to be inspected is placed on a stage 8 and the wiring pattern on the surface of the wafer 7 is read by an optical reading means 9. Data on the image obtained by the means 9 is converted by an electric signal converting means 10 into an electric signal, which is sent to the CPU 3. This electric signal is compared with the data on the wiring pattern on the surface of the reference normal article which is stored previously in the storage means 6 automatically to make a decision 6 on whether or not the article is normal. Consequently, whether or not the wiring pattern of a chip has a different part is inspected, so a development process is shortened and the quality is improved.
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