| 摘要 |
PURPOSE:To facilitate mirror finish of a wafer surface, by a method wherein a carrier plate to which a wafer is adhered is nipped by a pair of pressurizing platen for pressurization, and the two pressurizing plates are relatively rotated around the axis of the carrier plate by means of a rotating mechanism. CONSTITUTION:After wax is coated on the adhering surface of a silicone wafer W, the wafers are adhered on a rear plate CP at equal intervals. A given pressure is applied downward by a pressurizing shaft 12 in a state to nip the plate CP between ceramic plates 5 and 16 to pressurize the plate CP, and the interior of a vacuum cover 11 is sucked into a vacuum state. When, by the one full turn of a rotary plate 10, a rotary lever 8 is swung by a given angle through the medium of a link member 9 and a rotary disc 4 is swung togetherwith the plate 5, the plate CP is rotationally followed. This constitution forces the wafer W to be secured to the plate 16 by means of a friction force, and is swung over the plate CP by a given angle around the axis of the plate CP. As a result, the strain of the wafer W is prevented from production. |
