发明名称 METHOD FOR BONDING QUARTZ COMPONENTS BY HEAT BONDING
摘要 PURPOSE:To bond quartz components while preventing the presence of bubbles on the bonding surfaces and contamination of quarts by tying the quartz components with a high-m.p. wire rod with a specified metal piece or rod in between, and heating and bonding the parts. CONSTITUTION:The quartz components 4 such as an analytical quartz cell obtained by combining four side plates and one bottom plate is tied by a high-m. p. wire rod 2 such as a tungsten rod with the metallic piece or rod 3 (e.g., Cr) having >=1,750 deg.C m.p. and >=2.5X10<-4>/ deg.C thermal expansion coefficient in between, and heated. The loosening of the tying force due to the thermal expansion of the wire rod 2 is compensated with the expansion of the metal piece or rod 3, and the members are heated and bonded while keeping the tying force.
申请公布号 JPS63239133(A) 申请公布日期 1988.10.05
申请号 JP19870075515 申请日期 1987.03.27
申请人 SEIKO INSTR & ELECTRONICS LTD 发明人 KASHIMA KOTARO
分类号 C03B23/20;C03B23/203;C03B23/24 主分类号 C03B23/20
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