| 摘要 |
PURPOSE:To prevent defect density from increasing, by turning a resist surface on a substrate downwards and fixing a rear side of the substrate on a rotary board and spraying a developing liquid on the resist surface while rotating the board. CONSTITUTION:After a substrate 2 is coated with a negative-type electron beam resist 1 of 1 mum in thickness, electron beam exposure is performed with 10muC/cm<2> in the amount of exposure. Next, a rear side of the substrate 2 is fixed on a rotary board 4 having a vacuum chuck 3, and a developing liquid from a nozzle 5 is sprayed on a resist 1 surface, and the rotary board 4 is rotated to perform development. Hence, defect density can be prevented from increasing. |
