| 摘要 |
PURPOSE:To process two or more types of wafers having different diameters with the same boat by providing two or more sets of wafer supporting pins which can independently secure the wafers having different diameters on the same supporting plate. CONSTITUTION:In a semiconductor manufacturing apparatus for securing a disclike wafer 4 by utilizing wafer supporting pins 3 to a flat platelike supporting plate 2, two or more sets of wafer supporting pins 3a, 3b for independently securing two or more types of wafers 4a, 4b having different diameters are provided on the plate 2. For example, the two sets of pins 3a, 3b are inserted to a carbon boat 2 of a flat platelike supporting plate in such a manner that the pin 3a secures the wafer 4a of larger diameter and the pin 3b secures the wafer 4b of smaller diameter. Thus, it is not necessary to separately prepare the supporting plates for the respective wafer diameters, and time loss of replacing the supporting plates is eliminated, thereby improving the processing capacity. |
