CERAMIC PACKAGE

摘要

A ceramic package bearing an electrically conducting pattern and adapted to receive diminutive electronic components such as semiconductor elements includes metallic plugs in the conducting pattern to serve as islands to which internal lead connections to the semiconductor element are made. The plugs permit a high degree of flexibility in material selection for contact areas providing different metals without costly selective plating techniques. The resulting structure can be fabricated without any gold plating steps. Similar plugs may be used as islands to which external leads are connected.