| 摘要 |
<p>1. A power semiconductor arrangement comprising at least one semiconductor component which is materially connected to a good heat-conducting, electrically insulating substrate ; a metal base on which the substrate is arranged in thermal contact with the base ; a frame connected to the metal base ; at least two connecting conductors which serve to conduct a load current and which electrically connect the semiconductor component in each case to one of at least two terminal contacts which are arranged in a predetermined position on the upper side of the frame ; and a cast mass in which the connecting conductors and the semiconductor component are at least partially embedded, characterised by the following features : a) each of the connecting conductors consists of at least two parts (13, 14, 15; 16), b) the first part (13, 14, 15) is secured to the frame (8) and is essentially rigid, c) the second part (16) is flexible and is, on the one hand, electrically connected to the first part and, on the other hand, to the substrate (3, 5), or the semiconductor component (6, 7).</p> |
