Apparatus and methods for micro-transfer-printing

摘要

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

主权项

1. A method for assembling a plurality of semiconductor devices on a receiving surface of a destination substrate, the method comprising:
providing the plurality of semiconductor devices formed on a native substrate with a polymer layer disposed on a top surface of the semiconductor devices; contacting the polymer layer on each semiconductor device with a respective post of a plurality of posts of a conformable transfer device, each post having a contact surface corresponding to one of the semiconductor devices, wherein contact between the contact surface of each post and the corresponding polymer layer on each semiconductor device at least temporarily binds each semiconductor device to one of the corresponding posts of the conformable transfer device; separating the semiconductor devices from the native substrate so that the semiconductor device is disposed on the contact surface of a corresponding post of the conformable transfer device and is released from the native substrate; contacting the semiconductor devices disposed on the contact surfaces to the posts to the receiving surface of the destination substrate; after contacting the semiconductor devices to the receiving surface of the destination substrate, heating, by a heating element, the polymer layer, thereby reducing the adhesion between the polymer layer and the contact surfaces; and separating the contact surfaces of the posts of the conformable transfer device from the semiconductor devices so that the semiconductor devices are transferred onto the receiving surface, thereby assembling the semiconductor devices on the receiving surface of the destination substrate.