| 摘要 |
PURPOSE:To accurately apply a rejection mark only to defective wafer chips, by marking the surface of each of the defective wafer chips contained in a wafer by a discharge marking device having a discharge needle. CONSTITUTION:A signal is sent from a tester to a pad 42 of a wafer chip 41 through a probe of a probe card to test the electrical characteristics of the wafer chip. When the test result is bad, a predetermined voltage is applied to a discharge needle 82 by a voltage-applying device 84, whereby an electric discharge 100 is brought about between the discharge needle 82 and the conductive defective wafer chip, and the defective wafer chip is provided with a rejection mark constituted of an electrolytic corrosion caused by the discharge 100. |
